发明名称 LOW-EMI MULTILAYER CIRCUIT BOARD AND ELECTRIC AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To suppress unnecessary radiating noise by shielding a power supply layer with a first ground layer and a second ground layer, and connecting the first and second ground layers via through holes. SOLUTION: A power supply layer 2 is sandwiched between a first ground layer 1a and a second ground layer 1b having a large area, adjacently positioned above and below the power supply layer 2 with a gap in-between, and the first ground layer 1a and the second ground layer 1b are electrically connected with each other via through holes 4 positioned outside the power supply layer 2, that is, positioned on the peripheral side so that the power supply layer 2 is encircled with the through holes. As a result, the power supply layer 2 is shielded at its upper, lower and peripheral portions, and thus unnecessary radiation from the power supply layer 2 is suppressed. Therefore, unnecessary radiation from the power supply layer 2 in the direction of the sides of the substrate is suppressed, and installation of members for unnecessary radiation control is not required, and accordingly the manufacturing cost can be reduced.
申请公布号 JP2000183533(A) 申请公布日期 2000.06.30
申请号 JP19980359024 申请日期 1998.12.17
申请人 MITSUBISHI ELECTRIC CORP 发明人 UCHIDA TAKESHI;OKA NAOHITO;MIYAZAKI CHIHARU
分类号 H05K9/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K9/00
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