| 摘要 |
PROBLEM TO BE SOLVED: To align each shot region to an exposing position with high accuracy without degrading the throughput by correcting each step pitch for successively transferring each shot region to the exposing position based on the bending amount of a semiconductor wafer. SOLUTION: The bending amount at an alignment mark M5 positioned most outside with respect to the center 0 of a semiconductor wafer is measured. The bending amount is allocated proportionally to each of the alignment marks M1-M4 by taking inclination angle of the bending into account. As the bending amount at each of the alignment marks M1-M5 is thus obtained, the distance between each of the neighboring alignment marks along X-axis direction is calculated. As each of the distances a1-a5 between respective neighboring alignment marks along X-axis direction is obtained, the distance between the neighboring shot centers is calculated as the corrected step pitch for transferring each shot region to the exposing position. |
