| 摘要 |
PROBLEM TO BE SOLVED: To align a plurality of integrated circuit chip units having a transparent support substrate with high accuracy enable packaging the chip units within a package in a high density, by a method wherein the transparent support substrate is aligned with a substrate for package to mount the chip units temporality stopped on the support substrate on the substrate for package by facing-up. SOLUTION: A plurality of integrated circuit chip units are once temporarily stopped on a transparent support substrate (S9). After the chip units are mounted on a substrate for package by facing-up as the chip units are in a state in which the chip units are temporarily stopped on this support substrate (S10), the essentially unwanted support substrate is separated from the chip units mounted on the substrate for package (S11). For this, when the chip units are aligned with the support substrate and when the transparent support substrate temporarily stopped with the chip units is aligned with the substrate for package, the chip units and the support substrate can be aligned with each other with high accuracy, while the chip units and the support substrate are observed through the support substrate.
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