发明名称 PLASMA TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To suitably treat a flexible thin material by forming the face to be placed with the object to be treated in a device to be exposed to plasma with the object to be treated as the longitudinal into the curved face. SOLUTION: A work placing electrode face for placing the object to be treated is formed on an internal electrode 24 incorporated from the left and right to a containing part 25 in a vacuum chamber 20 of a plasma treating device 10. The work placing electrode face is finished into an arched and circular-arcuate smooth curved face whose center part has been recessed. In this way, the flexible thin object to be treated has forcedly been deformed in advance so as to conform along the curved face at the time of placing it on the placing face and executing fixing, by which, even if internal stress is generated in the process of plasma treatment, deformation caused thereby is buried to the forced deformation to some degree, and its exibition can be suppressed. Then, the contact between the back face and placing face in the object to be treated is maintained. Moreover, the work placing electrode face may be the projecting one.
申请公布号 JP2000319791(A) 申请公布日期 2000.11.21
申请号 JP19990125923 申请日期 1999.05.06
申请人 FOI:KK;DAINIPPON PRINTING CO LTD 发明人 TASHIRO MASAHITO;OKUMURA YUTAKA;TAKEI SHIGEO;IIMURA YUKIO
分类号 H05H1/46;C23F4/00 主分类号 H05H1/46
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