发明名称 METHOD FOR MANUFACTURING METAL POWDER, METAL POWDER, CONDUCTIVE PASTE AND LAMINATED CERAMIC ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing metal powder by which the initiation temperature for sintering is shifted to the high temperature side and steep shrinkage by sintering is suppressed and to provide the metal powder, a conductive paste containing the metal powder, and laminated ceramic electronic parts having inner electrodes formed by using the above conductive paste so as to suppress delamination and generation of cracks. SOLUTION: The method for manufacturing metal powder is carried out by preparing a metal salt solution having at least a powder of a first metal, a second metal salt containing a second metal, and tungstates and/or molybdates dispersed in a solvent, preparing a reducing agent solution containing a reducing agent, and mixing the solutions to precipitate the second metal in the second metal salt and precipitate tungsten and/or molybdenum in the tungstates and/or molybdates on the surface of the powder of the first metal.
申请公布号 JP2002275511(A) 申请公布日期 2002.09.25
申请号 JP20010074809 申请日期 2001.03.15
申请人 MURATA MFG CO LTD 发明人 HOSOKURA TADASHI;HONGO OUJIYU;MAEDA MASAYOSHI
分类号 B22F9/24;B22F1/00;B22F1/02;H01B1/00;H01B1/22;H01G4/008;H01G4/12;(IPC1-7):B22F9/24 主分类号 B22F9/24
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