| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor valuation apparatus and a method for valuing a semiconductor device, which are capable of carrying out the reliability valuation for a large number of semiconductor devices at high speed simultaneously. SOLUTION: The semiconductor valuation apparatus includes a plurality of connecting pads 4 located on the peripheries of opening portions 3 and connected with a plurality of pads of a semiconductor wafer to be valued by ones to ones, pins 2 which are located around a circumference of the wafer and test signals are inputted into, and wiring 5 connecting the connecting pads 4 with the pins 2.
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