| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enhance a bonding force between a land part and an external terminal, securely prevent omission, and secure reliability to connection over a long period of time. <P>SOLUTION: An insulating resin layer 4 insulating the space between metal wiring 7a is formed on a semiconductor element 1, and the end of the metal wiring is connected with an electrode 2 on the semiconductor element. The other end of the metal wiring is connected with the external terminal 9 as a land, and a semiconductor device is covered with a surface resin layer 8 except the connecting part of the land. On the upper surface of at least one land part 7b of the lands, a projection 10 is provided. Thereby, the external terminal complements the projection of the land part from the circumference at the time of solder bonding so as to make the connection between the external terminal and the land part secure. Consequently, a semiconductor device securing the reliability to connection over a long period of time can be obtained. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
