| 摘要 |
A fabrication method for a chip packaging structure disclosed herein is utilizing the method of plating metal to connect different layers so as to replace the traditional method that drill hole firstly and then plate metal in the hole. In the present invention, the metal in the conductive through hole is solid metal so as can provide good ability of heat sinking. Besides, the present fabrication method utilizes the existing manufacturing processes without extra process or equipment so as can decrease the PCB processes and lower the package cost.
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