| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reliable LED lamp by maximizing the characteristics of an LED chip without giving the influence of a protective resin to the LED chip, and giving mass producibility to a hermetic structure. <P>SOLUTION: In the LED lamp, an LED chip is mounted on a substrate where a metal frame is insert-molded, a plastic cover is directly stuck onto the substrate, and the LED chip is shielded. <P>COPYRIGHT: (C)2008,JPO&INPIT |
