| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform such a process that, when a board is formed to be convenient from the viewpoint of an electric supply to an LED chip by providing a mount part and a power supply part, as an insulating state is demanded for integration of the board, the integration can automatically be done simultaneously when a case is molded by resin molding, thereby enabling the process to be simplified and a cost to be reduced. <P>SOLUTION: Boards 2 are formed in a mount 2a and a power supply 2b to be in a predetermined shape in a state of having an appropriate gap therebetween. When a case 3 is molded, a resin to form this case is injected into the gap to be closed. Also, the mount 2a is adhered to the power supply 2b to obtain a structure of being integrated as a board 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
