| 摘要 |
PROBLEM TO BE SOLVED: To provide a working method for not generating dust from the end face of a printed wiring board. SOLUTION: In the method of working the printed wiring board, when the formation process of an outer layer circuit onto a surface and a punching work process following it are ended and solder resist 5 is to be applied to the surface of the printed wiring board whose working end face 2b is expressed at a formed punching work part, the solder resist 5 is applied simultaneously to the working end face 2b as well and dust generation from the working end face 2b is prevented. COPYRIGHT: (C)2009,JPO&INPIT
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