| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a TAB tape, which prevents bleeding out phenomenon where solder resist flows out in a drying curing process even if the interval between leads of wiring is not more than 25μm and stably manufactures the TAB tape of superior quality. SOLUTION: When applying solder resist on a surface of an insulating film where a wiring pattern is arranged except for a lead part of inner lead and outer lead in the wiring pattern, heating and curing it and forming a solder resist coating layer, anionic surface active agent is adsorbed to the surface of the insulating film in which the wiring pattern is arranged before application of solder resist. Anionic surface active agent of a fatty acid system, such as fatty acid amine, is desirable as anionic surface active agent. COPYRIGHT: (C)2009,JPO&INPIT
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