发明名称 |
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD |
摘要 |
Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for connecting one layer to another layer can include forming a circuit pattern on one surface of a carrier; processing a hole corresponding to the via on one surface of the carrier; compressing the surface of the carrier into one surface of an insulation body; removing the carrier; processing a via hole on the insulation body, corresponding to a position of the hole; and forming a conductive material in the via hole, to thereby easily process a hole for forming a via and have high design freedom
|
申请公布号 |
US2010018633(A1) |
申请公布日期 |
2010.01.28 |
申请号 |
US20090408366 |
申请日期 |
2009.03.20 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KANG MYUNG-SAM;PARK JUNG-HYUN;PARK JEONG-WOO;KIM JI-EUN |
分类号 |
B32B37/00 |
主分类号 |
B32B37/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|