ATHERMAL ARRAYED-WAVEGUIDE-GRATING WAVELENGTH DIVISION MULTIPLEXER AND MANUFACTURING METHOD THEREFOR

摘要

Disclosed are an athermal arrayed-waveguide-grating wavelength division multiplexer and a manufacturing method therefor. The athermal arrayed-waveguide-grating wavelength division multiplexer comprises an AWG chip (100), interlayers (200), a bottom plate (300) and a temperature compensating device (400). The interlayers (200) adopt a first interlayer and a second interlayer (203) with the expansion coefficients thereof being same or approximate to that of the AWG chip (100). The input waveguide, the input planar waveguide and the partial output planar waveguide of the AWG chip (100) are fixed on the first interlayer, and the output waveguide of the AWG chip (100) is fixed on the second interlayer (203). The input planar waveguide or the output planar waveguide of the AWG chip (100) are provided with a cutting seam (104) which divides the AWG chip (100) into a first chip (101) and a second chip (102). The first interlayer is divided into a first part (201) and a second part (202) along the direction of the face of the cutting seam (104). Thermally curing glue with a similar thermal expansion coefficient to that of the AWG chip (100) is arranged between the AWG chip (100) and the interlayers. The first part (201) of the first interlayer and the bottom plate are fixed by adopting bonding glue capable of realizing thermal expansion movement, and the second part (202) of the first interlayer and the second interlayer (203) are fixedly bonded to the upper surface of the bottom plate. Along the direction of the division plane, one end of the temperature compensating device (400) is fixed on the first chip (101) or the upper surface of the first part (201) of the first interlayer, and the other end of the temperature compensating device is fixed on the upper surface of the second interlayer (203).