TAPE FOR WAFER PROCESSING

摘要

PROBLEM TO BE SOLVED: To provide a tape for wafer processing capable of reducing occurrence of a label trace, improving a cool keeping property, and achieving lighter weight.SOLUTION: A tape for wafer processing comprises: a long mold releasing film; an adhesive layer having a prescribed planar shape and provided on a first surface of the mold releasing film; an adhesive film covering the adhesive layer and including a label part having the prescribed planar shape and provided so as to come into contact with the mold releasing film around the adhesive layer and a peripheral part provided so as to surround the outside of the label part; and a support member provided at both ends in a short direction of the mold releasing film. The support member includes a foam.SELECTED DRAWING: Figure 1