| 发明名称 |
HEAT DISSIPATION DEVICE AND METHOD OF DISSIPATING HEAT |
| 摘要 |
A heat dissipation device includes: a plurality of heat receiving members disposed on a plurality of electronic components mounted on a substrate; a plurality of heat pipes fixed to the respective heat receiving members; and a heat sink mounted on the substrate and includes a plurality of openings formed corresponding to the heat pipes, wherein the heat pipes are inserted in the respective openings, and an inner diameter of the openings in a perpendicular direction to a surface of the substrate is larger than a diameter of the heat pipes in the perpendicular direction to the surface of the substrate. |
| 申请公布号 |
US2016212881(A1) |
申请公布日期 |
2016.07.21 |
| 申请号 |
US201514977545 |
申请日期 |
2015.12.21 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
SAITO Osamu;IZUNO Takaharu;FUJII Minoru;JOKO Kenji;HAYASHI Mitsuaki;MATSUMOTO Hideaki;Kanasaki Katsumi |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat dissipation device comprising:
a plurality of heat receiving members disposed on a plurality of electronic components mounted on a substrate; a plurality of heat pipes fixed to the respective heat receiving members; and a heat sink mounted on the substrate and includes a plurality of openings formed corresponding to the heat pipes, wherein the heat pipes are inserted in the respective openings, and an inner diameter of the openings in a perpendicular direction to a surface of the substrate is larger than a diameter of the heat pipes in the perpendicular direction to the surface of the substrate. |
| 地址 |
Kawasaki-shi JP |
