发明名称 JOINT DEVICE, JOINT SYSTEM, AND JOINT METHOD
摘要 PROBLEM TO BE SOLVED: To achieve highly accurate jointing.SOLUTION: A joint device according to an embodiment comprises a first holding part, a second holding part, a pressurizing part, and a levelness adjustment part. The first holding part sucks and holds a first substrate. The second holding part is arranged opposedly to the first holding part in a vertical direction, and sucks and holds a second substrate. The pressurizing part is connected with a central part of the second holding part, and presses the second substrate against the first substrate by making the second holding part approach the first holding part. The levelness adjustment part is connected at an outer peripheral side of the second holding part than the pressurizing part, and adjusts a levelness of the second holding part.SELECTED DRAWING: Figure 9
申请公布号 JP2016134446(A) 申请公布日期 2016.07.25
申请号 JP20150007137 申请日期 2015.01.16
申请人 TOKYO ELECTRON LTD 发明人 KODAMA MUNEHISA;OTSUKA YOSHITAKA;YAMAGUCHI KIYOMITSU;YAMASAKI YUTAKA
分类号 H01L21/02;H01L21/683 主分类号 H01L21/02
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