Leadless chip carrier having improved mountability

摘要

Consistent with an example embodiment, there is surface-mountable non-leaded chip carrier for a semiconductor device. The device comprises a first contact. A second contact is relative to the first contact; the second contact has a split therein to provide first and second portions of the second contact arranged relative to one another to lessen tilting of a soldering condition involving attachment of the chip carrier to a printed circuit board.

主权项

1. A surface-mountable non-leaded chip carrier for a semiconductor device, comprising:
a first contact; a die mounted on the first contact and electrically coupled thereto; and a second contact spaced apart from the first contact, the second contact having a thickness extending from one side of the second contact to an opposing side of the second contact, being electrically coupled to the die via a bond wire and having a split therein that extends entirely through the thickness of the second contact at a first portion thereof, and that extends partially through the thickness of the second contact at a second portion thereof, and divides the second contact into contiguous first and second portions configured and arranged to provide solder-connection areas for attachment of the chip carrier to a printed circuit board (PCB) and configured and arranged relative to one another to lessen tilting of a soldering condition involving the attachment of the chip carrier to the PCB, the first and second portions of the second contact configured and arranged with opposing surface areas that are adjacent to the solder-connection areas and that manifest solder thereon due to the soldering condition.