发明名称 |
Circuit film with bump, film package using the same, and related fabrication methods |
摘要 |
A circuit film having film bumps is provided for a film package. An IC chip is mechanically joined and electrically coupled to the circuit film through the film bumps instead of conventional chip bumps. In a fabrication method, a base film is partially etched by a laser to create an etched area that defines raised portion relatively raised from the etched area. Then a circuit pattern is selectively formed on the base film, partly running over the raised portions. The raised portion and the overlying circuit pattern constitute the film bumps having a height not greater than the height of the circuit film.
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申请公布号 |
US2005285277(A1) |
申请公布日期 |
2005.12.29 |
申请号 |
US20050158164 |
申请日期 |
2005.06.20 |
申请人 |
KWON YONG-HWAN;KANG SA-YOON;LEE CHUNG-SUN;CHOI KYOUNG-SEI |
发明人 |
KWON YONG-HWAN;KANG SA-YOON;LEE CHUNG-SUN;CHOI KYOUNG-SEI |
分类号 |
G02F1/1345;H01L21/44;H01L21/56;H01L23/12;H01L23/498;H05K3/00;H05K3/32;H05K3/40;(IPC1-7):H01L23/12 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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