发明名称 SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD
摘要 In one embodiment, a substrate treatment method includes cleaning and rinsing a surface of a substrate provided with a pattern, and supplying a solidifying agent containing liquid that contains a solidifying agent to the cleaned and rinsed surface of the substrate. The method further includes precipitating the solidifying agent as solid on the surface of the substrate, and decomposing and gasifying the solid to remove the solid from the surface of the substrate. Furthermore the solidifying agent contains an ammonium salt, and the ammonium salt contains an ammonium ion or an ion having a structure in which at least one of four hydrogen atoms of an ammonium ion is substituted with another atom or an atom group.
申请公布号 US2016365240(A1) 申请公布日期 2016.12.15
申请号 US201614986977 申请日期 2016.01.04
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SUGITA Tomohiko;SATO Katsuhiro;llMORI Hiroyasu;OGAWA Yoshihiro
分类号 H01L21/02;B08B3/10;H01L21/67 主分类号 H01L21/02
代理机构 代理人
主权项 1. A substrate treatment method comprising: cleaning and rinsing a surface of a substrate provided with a pattern; supplying a solidifying agent containing liquid that contains a solidifying agent to the cleaned and rinsed surface of the substrate; precipitating the solidifying agent as solid on the surface of the substrate; and decomposing and gasifying the solid to remove the solid from the surface of the substrate, wherein the solidifying agent contains an ammonium salt, and the ammonium salt contains an ammonium ion or an ion having a structure in which at least one of four hydrogen atoms of an ammonium ion is substituted with another atom or an atom group.
地址 Minato-ku JP