发明名称 Method of manufacturing phosphor for light-emitting diode
摘要 The present invention provides a method of manufacturing a phosphor for a light-emitting diode, including filling a phosphor frame in which phosphor models are formed in an engraving form with a fluorescent material solution including a fluorescent material that converts light provided by the light-emitting diode into white light by changing a wavelength of the light provided by the light-emitting diode, polishing a top surface of the phosphor frame filled with the fluorescent material solution, and drying the phosphor frame filled with the fluorescent material solution and polished.
申请公布号 US9525112(B2) 申请公布日期 2016.12.20
申请号 US201314013437 申请日期 2013.08.29
申请人 LIGHTIZER KOREA CO. 发明人 Min Jae Sik;Jang Jae Young;Cho Byoung Gu
分类号 H01L33/52;H01L33/00 主分类号 H01L33/52
代理机构 Keohane & D'Alessandro PLLC 代理人 Webb Hunter E.;Keohane & D'Alessandro PLLC
主权项 1. A method of manufacturing a phosphor for a light-emitting diode (LED), the method comprising: filling a phosphor frame in which phosphor models are formed in an engraving form with a fluorescent material solution comprising a fluorescent material that converts light provided by the light-emitting diode into white light by changing a wavelength of the light provided by the light-emitting diode, wherein the phosphor models are filled with the fluorescent material solution to the extent that the fluorescent material solution overflows the phosphor models; adjusting a light-emitting-color to reduce a variance among individual model-formed phosphors in the phosphor frame by polishing a top surface of the phosphor frame filled with the fluorescent material solution to a conformable thickness; drying the phosphor frame filled with the fluorescent material solution; and separating each of the model-formed phosphors from the phosphor frame wherein hardness (Durometer Shore D) of the model-formed phosphor separated from the phosphor frame is 25 to 75 after drying the polished phosphor frame; and wherein the hardness of the model-formed phosphor separated from the phosphor frame is controlled by changing an addition ratio (wt %) of the hardner, and wherein a ratio of the phosphor to silicon in the model-formed phosphor is substantially 1:1.
地址 Seoul KR
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