发明名称 |
Method of manufacturing phosphor for light-emitting diode |
摘要 |
The present invention provides a method of manufacturing a phosphor for a light-emitting diode, including filling a phosphor frame in which phosphor models are formed in an engraving form with a fluorescent material solution including a fluorescent material that converts light provided by the light-emitting diode into white light by changing a wavelength of the light provided by the light-emitting diode, polishing a top surface of the phosphor frame filled with the fluorescent material solution, and drying the phosphor frame filled with the fluorescent material solution and polished. |
申请公布号 |
US9525112(B2) |
申请公布日期 |
2016.12.20 |
申请号 |
US201314013437 |
申请日期 |
2013.08.29 |
申请人 |
LIGHTIZER KOREA CO. |
发明人 |
Min Jae Sik;Jang Jae Young;Cho Byoung Gu |
分类号 |
H01L33/52;H01L33/00 |
主分类号 |
H01L33/52 |
代理机构 |
Keohane & D'Alessandro PLLC |
代理人 |
Webb Hunter E.;Keohane & D'Alessandro PLLC |
主权项 |
1. A method of manufacturing a phosphor for a light-emitting diode (LED), the method comprising:
filling a phosphor frame in which phosphor models are formed in an engraving form with a fluorescent material solution comprising a fluorescent material that converts light provided by the light-emitting diode into white light by changing a wavelength of the light provided by the light-emitting diode, wherein the phosphor models are filled with the fluorescent material solution to the extent that the fluorescent material solution overflows the phosphor models; adjusting a light-emitting-color to reduce a variance among individual model-formed phosphors in the phosphor frame by polishing a top surface of the phosphor frame filled with the fluorescent material solution to a conformable thickness; drying the phosphor frame filled with the fluorescent material solution; and separating each of the model-formed phosphors from the phosphor frame wherein hardness (Durometer Shore D) of the model-formed phosphor separated from the phosphor frame is 25 to 75 after drying the polished phosphor frame; and wherein the hardness of the model-formed phosphor separated from the phosphor frame is controlled by changing an addition ratio (wt %) of the hardner, and wherein a ratio of the phosphor to silicon in the model-formed phosphor is substantially 1:1. |
地址 |
Seoul KR |