| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of enhancing the connection reliability of a via conductor and a conductor layer, by suppressing exfoliation of the via conductor from the conductor layer more than conventional, and to provide a manufacturing method therefor.SOLUTION: In the wiring board 10, both first and second insulation resin layers 21, 23 have a two-layer structure consisting of a support insulation layer 29 and an underlying coating insulating layer 28. A first conductor layer 22 or a second insulating resin layer 23 is formed on the support insulation layer 29, and the coating insulating layer 28 is covering an underlying conductor circuit layer 12 or the first conductor layer 22. The coating insulating layer 28 has a larger percentage content of inorganic filler and a smaller coefficient of thermal expansion than the support insulation layer 29.SELECTED DRAWING: Figure 1 |
