ELECTRONIC COMPONENT PACKAGE AND PACKAGE-ON-PACKAGE STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an electronic component package and a package-on-package structure.SOLUTION: An electronic component package includes: a frame containing a metal or ceramic based material and having a through-hole; an electronic component disposed in the through-hole; an insulating part at least covering upper portions of the frame and the electronic component; a bonding part at least partially disposed between the frame and the insulating part; and a redistribution part disposed at one side of the frame and the electronic component. The invention relates to the electronic component package and a package-on-package structure.SELECTED DRAWING: Figure 3