| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate flattening method capable of easily and precisely flattening the substrate surface.SOLUTION: According to an embodiment, a method for flattening a substrate is provided. In the substrate flattening method, a resist having an amount corresponding to the volume of the recess caused by the topography is dropped from above a substrate having a topography that is a non-planar deviation in a predetermined region. The blank template or the substrate is then moved so that the distance between the blank template having a flat impression surface and the substrate is a predetermined distance. As a result, the impression surface of the blank template is pressed against the resist. Then, the resist is cured. Thereafter, the blank template is released from the resist. Then, the entire surface of the substrate is etched from above the resist. Further, the resist amount of the resist dropped onto the substrate is adjusted for each shot of the substrate.SELECTED DRAWING: Figure 5 |
