Method and device for mounting electronic component on circuit board

摘要

When mounting an IC chip on a circuit board, bumps are formed on electrodes of the IC chip, and the bumps and the electrodes of the circuit board are aligned in position with each other with interposition of an insulative thermosetting resin having no conductive particle between the electrodes of the circuit board and the bumps. The IC chip is pressed against the circuit board with a pressure force of not smaller than 20 gf per bump by a heated head so as to perform warp correction of the IC chip and the board, while the resin interposed between the IC chip and the circuit board is hardened to bond the IC chip and the circuit board together.