Electroless copper deposition,申请号US19920924842-传众专利搜索

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发明名称	Electroless copper deposition
摘要
申请公布号	US5258200(A)	申请公布日期	1993.11.02
申请号	US19920924842	申请日期	1992.08.04
申请人	AMP-AKZO CORPORATION	发明人	MAYERNIK, RICHARD A.
分类号	C23C18/40;H05K3/18;(IPC1-7):C23C26/00	主分类号	C23C18/40
代理机构		代理人
主权项
地址

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