| 摘要 |
<p>A heat treatment system is fabricated from a loading section (21), a heat treatment section (22) and a outlet section (23) integrated with one another, and the heat treatment section comprises a transfer mechanism (22a) provided between the loading section and the outlet section for successively transferring silicon wafers (W), a heating unit (22b) provided along the transfer mechanism for heating the silicon wafers, and a cooling unit (22c) provided along the transfer mechanism and closer to the outlet section than the heating section for cooling the silicon wafers so that the silicon wafers are continuously treated with heat for killing thermal donor without any handling by operators. <IMAGE></p> |
