发明名称 |
PRINTED CIRCUIT BOARD WITH ENHANCED BINDING OF OUTMOST RESIN LAYERS, METHOD OF MANUFACTURING THE PCB, A SEMICONDUCTOR PACKAGE COMPRISING THE PCB AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE |
摘要 |
A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having one or more supporting layers, a plurality of metal wires that may be formed as a plurality of inner connection pads and a plurality of outer connection pads, an outermost resin layer pattern formed on the surface of the main body, and including a plurality of openings exposing the plurality of outer connection pads, and a metal oxide layer disposed between the plurality of metal wires and the outermost resin layer pattern. The plurality of inner and outer connection pads may be formed on a surface of the main body. |
申请公布号 |
KR20060000106(A) |
申请公布日期 |
2006.01.06 |
申请号 |
KR20040049002 |
申请日期 |
2004.06.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, HYEONG SEOB |
分类号 |
H01L23/12;H01L21/48;H01L21/56;H01L23/31;H01L23/498;H01L23/58;H05K3/28;H05K3/38 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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