Method of applying bumps on a semiconductor device and connecting it with a printed circuit board.

摘要

A substrate preliminarily formed with bumps by electrolytic plating or other technique is prepared. A semiconductor device (23) is opposed to a substrate (2) with the bumps (22) so that the Al electrodes (24) of the semiconductor device (23) are aligned with respect to the bumps (22) and brought into contact with each other and bonded together. Subsequently, the bumps (22) are peeled off from the substrate (2) so as to be transferred to the respective Al electrodes (24). Thereafter, the semiconductor device (23) is opposed to a circuit board (21) so that the bumps (22) are aligned with respect to the electrodes of wiring (27) and brought into contact with them. Then, the bumps (22) and the electrodes of wiring (27) are bonded together more securely by the application of a larger pressure at a higher temperature or by the application of pressure and heat for a longer period of time than in the preceding process with another Au-Al alloy layer newly formed therebetween to cover a wider range. The method is applied to the flip flop method or to the MBB method.