发明名称 HEAT BONDING OF OLEFIN RESIN MOLDING
摘要 PURPOSE:To provide a method of heat-bonding an olefin resin molding which can give an easy-release container (packaging material) by forming a coating layer of a specified quat. ammonium salt type acrylic copolymer on the surface of a molding. CONSTITUTION:A quat. ammonium salt type acrylic polymer layer is formed on the surface of a propylene resin molding, and the obtained molding is laminated with a molding having an ethylene resin layer of a melting point at least 15 deg.C-below that of the propylene resin, and both the molding are heat-bonded to each other. The above quat. ammonium salt type acrylic polymer comprises structural units of formula I (wherein A is -O- or -NH-; R<1> is H or methyl; R<2> is 2-4C alkylene, -CH2-CH(OH)-CH2-; R<3> to R<6> are each 1-3C alkyl; R<7> is 1-10C alkyl or 7-10 C aralkyl; n is 1-3; and X is chlorine, bromine or iodine, structural units of formula II (wherein R<8> is H or methyl; R<9> is 1-22C alkyl, 7-22C aralkyl or 5-22C cycloalkyl) and structural units of other copolymerizable monomers. The ratio by weight among them is (30-7):(30-70):(0-40).
申请公布号 JPH0762112(A) 申请公布日期 1995.03.07
申请号 JP19930216341 申请日期 1993.08.31
申请人 OJI YUKA SYNTHETIC PAPER CO LTD 发明人 HOSONO TAIJI;FUNATO TAKASHI;CHIBA NORIYOSHI;ASAMI KOICHI;TAKAHASHI RYOJI
分类号 B29C65/02;B29K23/00;C08J5/12;C09J5/00;C09J5/06;H05K13/02 主分类号 B29C65/02
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