| 发明名称 |
Method for producing a layer with reduced mechanical stresses |
| 摘要 |
For producing a layer having reduced mechanical stresses, the layer is composed of at least two sub-layers that are matched to one another such that stress gradients in the two layers substantially compensate. The method is particularly employable in the manufacture of structures in surface micromechanics.
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| 申请公布号 |
US5753134(A) |
申请公布日期 |
1998.05.19 |
| 申请号 |
US19940347118 |
申请日期 |
1994.11.23 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BIEBL, MARKUS |
| 分类号 |
H01L21/20;B81B3/00;G01L9/00;H01L21/314;(IPC1-7):H01L21/02 |
主分类号 |
H01L21/20 |
| 代理机构 |
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代理人 |
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