发明名称 PHOTOSENSITIVE RESIN COMPOSITION FOR FAR UV EXPOSURE
摘要 PROBLEM TO BE SOLVED: To obtain a photosensitive resin compsn. for far UV exposure for lithography which uses a stepper-type exposure device with far UV rays as the exposure light, by incorporating a specified photoacid producing agent and a resin having substituents which increase the solubility by acid for an alkali developer and specifying the optical density for far UV exposure. SOLUTION: This compsn. contains a photoacid producing agent expressed by formulae I to VII and a resin having substituents which increase the solubility by acid for an alkali developer, and the compsn. is formed to obtain <=0.40μm<-1> optical density for exposure light of 170 to 220nm wavelength per 1.0μm thickness of the film. In formula I to VII, R1 R4 , R7 , R8 , R17 to R20 are independently alkyl groups, substd. alkyl groups, cycloalkyl groups, or substd. cycloalkyl groups, A is -SO2 - or -CO-, R5 , R6 , R9 , R10 , R15 , R16 are independently hydrogen atoms, alkyl groups, substd. alkyl groups, etc., and m is 1 or 2.
申请公布号 JPH10142777(A) 申请公布日期 1998.05.29
申请号 JP19960298879 申请日期 1996.11.11
申请人 FUJI PHOTO FILM CO LTD 发明人 SATO KENICHIRO
分类号 G03F7/004;G03F7/039;H01L21/027;(IPC1-7):G03F7/004 主分类号 G03F7/004
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