| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, which has good flowability on molding and high adherence to semiconductor members, also has good curability on molding and is excellent in shelf stability at ordinary temperature, and a semiconductor device sealed with the composition. SOLUTION: The epoxy resin composition for sealing a semiconductor contains an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a silane coupling agent (D), wherein the silane coupling agent (D) contains 0.5-10 wt.% of a silane coupling agent represented by formula (I).
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