| 摘要 |
PROBLEM TO BE SOLVED: To provide an image pickup device which is made thin while suppressing an increase in the number of new working processes or in cost. SOLUTION: Light which is made incident to a lens 2 held on a lens-barrel 6 of a stereoscopic substrate 1 through which visible light is not almost transmitted is made incident to a semiconductor imaging device 4 held in the stereoscopic substrate 1. On the side of the stereoscopic substrate 1 opposite to the lens-barrel 6, a flexible printed circuit board 8 is provided for exchanging signals with the semiconductor imaging device 4. The area of the flexible printed circuit board 8 confronted with the semiconductor imaging device 4 has a sufficient light shielding property in the photo-sensitive area of the semiconductor imaging device 4. COPYRIGHT: (C)2005,JPO&NCIPI
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