| 摘要 |
PROBLEM TO BE SOLVED: To arrange a plurality of vias at an intersection point of upper and lower conductive wires without wasting wiring tracks. SOLUTION: This semiconductor integrated circuit is provided with: a first conductive wire 11 extending in a first direction; a second conductive wire 12 arranged on the first conductive wire 11, and extending in a second direction intersecting the first direction; a first via 13 connecting a first contact part P1 of the first conductive wire 11 to a second contact part P2 of the second conductive wire 12; and a second via 14 connecting a third contact part P3 of the first conductive wire 11 to a fourth contact part P4 of the second conductive wire 12. The first and third contact parts P1 and P3 are arranged side by side in the first direction, and the second and fourth contact parts P2 and P4 are arranged side by side in the second direction. COPYRIGHT: (C)2009,JPO&INPIT |
