| 发明名称 |
TETRAMETHYLBIPHENOL EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT AND SEMICONDUCTOR SEALING MATERIAL |
| 摘要 |
The present invention pertains to a tetramethylbiphenol epoxy resin wherein the content of sodium ions therein as measured by the following measurement method is 1-12 ppm. (Measurement method) Measurement is conducted by atomic absorption spectroscopy using a solution obtained by dissolving a sample in N-methylpyrrolidone. |
| 申请公布号 |
WO2016088815(A1) |
申请公布日期 |
2016.06.09 |
| 申请号 |
WO2015JP83939 |
申请日期 |
2015.12.02 |
| 申请人 |
MITSUBISHI CHEMICAL CORPORATION |
发明人 |
OOTA KAZUMASA |
| 分类号 |
C08G59/00;H01L23/29;H01L23/31 |
主分类号 |
C08G59/00 |
| 代理机构 |
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