METHODS & APPARATUS FOR OBTAINING DIAGNOSTIC INFORMATION RELATING TO A LITHOGRAPHIC MANUFACTURING PROCESS, LITHOGRAPHIC PROCESSING SYSTEM INCLUDING DIAGNOSTIC APPARATUS

摘要

A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors (202) within a lithographic apparatus, and/or a separate metrology tool (240). Other inspections tools (244, 248) perform wafer backside inspection to produce second measurement data (302). High- resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed (CORR) to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map (506) is used to identify potentially relevant clusters of defects in the more detailed original defect map (520). The responsible apparatus can be identified by pattern recognition (PREC) as part of automated root cause analysis, alternatively, reticle inspection data may be used as second measurement data (302).