| 摘要 |
Disclosed is a hot stamping apparatus and method for preventing plating from sticking to a mold. An aspect of the present invention may provide a hot stamping apparatus for preventing plating from sticking to a mold, the apparatus comprising a mold for receiving a heated plated material supplied thereto, pressure-molding the material, and rapidly cooling the material while the material is clamped in the mold, wherein, before the material is pressure-molded, a plating sticking inhibiting layer is formed on the surfaces of the mold, which are placed in contact with the plated material. |
