发明名称 LED PACKAGE FOR LAMP OF VEHICLE
摘要 Disclosed is a light emitting diode (LED) package for a lamp of a vehicle. The LED package includes a printed circuit board (PCB) which includes a metal layer, an insulating layer formed on the metal layer, and an electric wiring layer formed on the insulating layer; an LED circuit unit which includes an LED chip mounted on the electric wiring layer; and a connector which is mounted on the electric wiring layer to be connected with the LED chip. Area and thickness of the printed circuit board and position of the LED chip on the printed circuit board can be determined based on thermal resistance of the LED chip and thermal resistance of the PCB.
申请公布号 US2016212853(A1) 申请公布日期 2016.07.21
申请号 US201614996059 申请日期 2016.01.14
申请人 HYUNDAI MOBIS CO., LTD 发明人 Kang Hyun Woo
分类号 H05K1/18;H05K1/05 主分类号 H05K1/18
代理机构 代理人
主权项 1. A light emitting diode (LED) package for a lamp of a vehicle, comprising: a printed circuit board (PCB) having an area and a thickness, the printed circuit board comprising a metal layer, an insulating layer formed over the metal layer, and an electric wiring layer formed over the insulating layer; an LED circuit unit which includes an LED chip mounted on the electric wiring layer of the printed circuit board; and a connector mounted on the electric wiring layer and electrically connected with the LED chip, wherein the area and the thickness of the printed circuit board is dertermined using a total thermal resistance that is obtained by summing thermal resistance of the LED chip and thermal resistance of the PCB, wherein a location of the printed circuit board where the LED chip is mounted is dertermined using the total thermal resistance.
地址 Seoul KR