| 主权项 |
1. A process for the manufacture of a multilayer assembly, said process comprising:
applying a patterned layer (LMP) of at least one patterned substrate onto a non-patterned layer (LMT) of at least one non-patterned substrate, thereby providing a multilayer assembly, wherein: (1) the at least one patterned substrate is obtainable by a process comprising:
printing a liquid composition (L1) comprising at least one first metal compound (M1) onto at least one surface of an optically transparent substrate layer (LT-1) having an outer surface and an inner surface to form a patterned layer (LMP), thus providing a patterned substrate,optionally, contacting the patterned layer (LMP) with a liquid composition (L2) comprising at least one second metal compound (M2), said compound (M2) being equal to or different from the compound (M1), anddrying the patterned substrate, optionally contacted with composition, (L2), at a temperature of at least 50° C.; and wherein (2) the providing at least one non-patterned substrate is obtainable by a process comprising:
optionally, treating by a radio-frequency glow discharge process in the presence of an etching gas, at least one surface of an optically transparent substrate layer (LT-2) having an outer surface and an inner surface, said layer (LT-2) being equal to or different from layer (LT-1),contacting optionally treated layer (LT-2) with a liquid composition (L3) comprising at least one optically transparent metal compound (Mot), to form an optically transparent non-patterned layer (LMT), thus providing a non-patterned substrate, anddrying the non-patterned substrate at a temperature of at least 50° C. |
