SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

摘要

The present invention relates to a semiconductor device and a manufacturing method thereof, capable of enabling communication with an antenna of a semiconductor device while shielding unnecessary electronic waves by selectively shielding electronic waves, applied to the semiconductor device, through a metal pattern of a complex thin plate. The present invention includes: a complex thin plate forming step of forming a complex thin plate comprising a metal pattern and a dielectric layer, and of which metal pattern is exposed to a first surface; a semiconductor die attachment step of placing a second surface of a semiconductor die, of which first surface includes multiple conductive pads, on the first surface of the complex thin plate; an insulating layer forming step of forming an insulating layer to cover both the first surfaces of the complex thin plate and the semiconductor die; a rewiring layer forming step of forming a via hole from a first surface of the insulating layer to expose the conductive pads of the semiconductor die to the outside through the insulating layer, and forming multiple rewiring layers on the first surface of the insulating layer to be electrically connected with the conductive pads exposed through the first surface of the insulating layer; and a conductive bump forming step of forming a conductive bump on the rewiring layer formed on the insulating layer.