High power dissipation mezzanine card cooling frame

摘要

Some embodiments are directed to cooling frames for mezzanine cards, mezzanine card assemblies and circuit card assemblies. A recessed cooling frame may be used to dissipate heat generated by components of a mezzanine card. The cooling frame may be directly coupled to a host card or host card cooling frame, thereby reducing the number of interfaces and reducing the thermal resistance of the heat dissipation pathway. The cooling frames of some embodiments may provide more efficient heat dissipation and thereby allow higher performance mezzanine cards to be used. Some embodiments provide a mezzanine card assembly that conforms to the mechanical envelope dimensions of the VITA 20, VITA 42 or VITA 61 specifications.

主权项

1. A mezzanine card assembly comprising:
a mezzanine card of a non-rectangular shape, the mezzanine card comprising:
a first mezzanine surface with at least one component mounted thereto; anda second mezzanine surface opposing the first mezzanine surface; and a mezzanine card cooling frame configured to be directly thermally coupled to a host card cooling frame of a host card having a single-printed wiring board structure, wherein joint dimensions of the mezzanine card cooling frame and the mezzanine card together conform to a standard dimensions requirements, wherein the mezzanine card cooling frame comprises:
a main body;at least one protrusion; andat least one sidewall connecting the main body to the at least one protrusion, wherein the at least one protrusion is configured to fit into a cut-out in a single-printed wiring board, wherein a first thickness of the at least one protrusion is configured to be substantially equal to a second thickness of the single-printed wiring board, and wherein the first thickness and the second thickness are in the direction of the at least one sidewall.