| 发明名称 |
Method for Producing a Printed Circuit Board |
| 摘要 |
A method for producing a printed circuit board is disclosed. In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate. |
| 申请公布号 |
US2016249458(A1) |
申请公布日期 |
2016.08.25 |
| 申请号 |
US201615048510 |
申请日期 |
2016.02.19 |
| 申请人 |
NextGin Technology BV |
发明人 |
Tourne J.A.A.M. |
| 分类号 |
H05K3/10 |
主分类号 |
H05K3/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for producing a printed circuit board, comprising the steps of:
forming a slot in a substrate having at least three layers with the slot extending through at least two of the layers, the slot having a length and a width with the length being greater than the width; coating a sidewall of the substrate surrounding the slot with a conductive layer; separating the conductive layer into at least two segments that are electrically isolated along the side wall of the substrate. |
| 地址 |
Helmond NL |
