| 发明名称 | Method of forming a semiconductor package | ||
| 摘要 | A method of forming a semiconductor package includes forming an interconnecting structure on an adhesive layer, wherein the adhesive layer is on a carrier. The method further includes placing a semiconductor die on a surface of the interconnecting structure. The method further includes placing a package structure on the surface of the interconnecting structure, wherein the semiconductor die fits in a space between the interconnecting structure and the package structure. The method further includes performing a reflow to bond the package structure to the interconnecting structure. | ||
| 申请公布号 | US9431367(B2) | 申请公布日期 | 2016.08.30 |
| 申请号 | US201414503932 | 申请日期 | 2014.10.01 |
| 申请人 | Taiwan Semiconductor Manufacturing Co., Ltd. | 发明人 | Lin Jing-Cheng;Chang Chin-Chuan;Hung Jui-Pin |
| 分类号 | H01L21/00;H01L23/00;H01L23/31;H01L23/498;H01L21/48;H01L21/56;H01L25/03;H01L25/00;H01L25/065 | 主分类号 | H01L21/00 |
| 代理机构 | Eschweiler & Associates, LLC | 代理人 | Eschweiler & Associates, LLC |
| 主权项 | 1. A method of forming a semiconductor package, the method comprising: forming an interconnecting structure on an adhesive layer, wherein the adhesive layer is on a carrier; placing a semiconductor die on a surface of the interconnecting structure; placing a package structure on the surface of the interconnecting structure, wherein the semiconductor die fits in a space between the interconnecting structure and the package structure; performing a reflow to bond the package structure to the interconnecting structure, wherein the reflow also bonds the semiconductor die to the interconnecting structure; and covering the package structure and the semiconductor die with a molding layer, wherein the molding layer contacts a top surface of the semiconductor die and a bottom surface of the package structure. | ||
| 地址 | Hsin-Chu TW | ||