| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ultraviolet irradiation device where the device can remarkably be miniaturized, facility of maintenance/inspection, and workability and power-saving of UV irradiation are realized. <P>SOLUTION: A semiconductor wafer to which a protection sheet S is stuck through an ultraviolet curing-type adhesive layer is set to be a body to be irradiated. An ultraviolet irradiation part 12 where a plurality of ultraviolet light emitting diodes 21 are arranged on a substrate 20 is disposed in a position confronted with the body to be irradiated. The light emitting diodes 21 are installed on straight lines L1 of a plurality of columns, which are almost orthogonal with a relative moving direction with a wafer, by leaving equal intervals. A part of the light emitting diodes in the adjacent column are arranged between the adjacent light emitting diodes 21 in the respective columns. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
