| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition and a prepreg, a laminate sheet, and a printed wiring board using the same.SOLUTION: This thermosetting resin composition includes a thermoplastic elastomer, and a modified silicone compound obtained by reacting a siloxane diamine expressed by a specified chemical formula, a maleimide compound having at least two unsaturated N-substituted maleimide groups within the molecule structure thereof, and an amine compound having an acidic substituent. A prepreg, a laminate sheet, and a printed wiring board using the thermosetting resin composition are also provided. |
