发明名称 MEDICAL ELECTRICAL LEAD JOINTS AND METHODS OF MANUFACTURE
摘要 A joint between an insulative sidewall of a medical electrical lead subassembly and an underlying fluoropolymer layer includes an interfacial layer. A first section of the interfacial layer is bonded to the fluoropolymer layer and is formed by a thermoplastic fluoropolymer; a second section of the interfacial layer extends adjacent the first section and is bonded to the insulative sidewall. The insulative sidewall, of the subassembly, and the second section, of the interfacial layer, are each formed from a material that is not a fluoropolymer. A recess is formed in the first section of the interfacial layer and the second section of the interfacial layer extends within the recess.
申请公布号 US2016351293(A1) 申请公布日期 2016.12.01
申请号 US201615231485 申请日期 2016.08.08
申请人 Medtronic, Inc. 发明人 SEIFERT Kevin R.;GRENZ Kathleen M.
分类号 H01B7/02;A61N1/36;A61N1/39;B29C65/52;B29C65/02;B29C65/00;B29C65/48;A61N1/04;A61B5/05 主分类号 H01B7/02
代理机构 代理人
主权项 1. A method for manufacturing a joint in a medical electrical lead, the joint being between an inner surface of an insulative sidewall of the lead and an outer surface of a tubular fluoropolymer layer, the method comprising: thermally bonding a thermoplastic fluoropolymer layer to the outer surface of the fluoropolymer layer, and providing the thermoplastic fluoropolymer layer an outer surface of the thermoplastic fluoropolymer layer with a recess formed therein; assembling a layer of another material into the recess formed in the outer surface of the thermoplastic fluoropolymer layer; thereafter adhesively bonding the other material layer in the recess formed in the outer surface of the thermoplastic fluoropolymer layer to the inner surface of the insulative sidewall of the subassembly; wherein the other material layer and the insulative sidewall of the subassembly are each formed from a material that does not comprise a fluoropolymer.
地址 Minneapolis MN US