发明名称 Optical waveguide and manufacturing method thereof
摘要 The optical waveguide includes: a lower clad layer, a core layer, an upper clad layer, a substrate, and a mirror, the lower clad layer, the core layer, and the upper clad layer being sequentially laminated to the substrate, the mirror being formed on the core layer, in which the substrate has an opening, the maximum diameter of the opening is larger than that of luminous flux reflected by the mirror, and the maximum diameter of the opening is 240 μm or less. The optical waveguide is capable of transmitting a light signal regardless of the type of the substrate, suppressing the spread of a light signal reflected from the mirror, and transmitting a light signal with a low optical transmission loss.
申请公布号 US9513434(B2) 申请公布日期 2016.12.06
申请号 US201214371591 申请日期 2012.12.28
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 Sakai Daichi;Kuroda Toshihiro;Betsui Hiroshi;Segawa Kouta;Uchigasaki Masao
分类号 G02B6/136;G02B6/036;G02B6/122;G02B6/43;G02B6/13;G02B6/12 主分类号 G02B6/136
代理机构 Fitch, Even, Tabin & Flannery, LLP 代理人 Fitch, Even, Tabin & Flannery, LLP
主权项 1. A method of producing an optical waveguide comprising: a lower clad layer, a core layer, an upper clad layer, a substrate, and a mirror, the lower clad layer, the core layer, and the upper clad layer being sequentially laminated to the substrate, the mirror being formed on the core layer, wherein the substrate has an opening, the maximum diameter of the opening is larger than that of luminous flux reflected by the mirror, and the maximum diameter of the opening is 240 μm or less, and a pillar-shaped transparent member projecting from the opening beyond the back surface direction of the substrate, the method comprising: a step (A) of laminating a transparent resin layer A formed of a transparent resin a to one surface of a substrate having an opening and filling at least a part of the opening on the substrate with a transparent resin a while laminating a transparent resin layer B formed of a transparent resin b to the back surface of the substrate; a step (B) of exposing the opening from the transparent resin layer A formed surface side to light-cure the transparent resin b on and in the opening; and a step (C) of developing and removing the transparent resin layer B as the uncured part after the step (B) to form a pillar-shaped transparent member.
地址 Tokyo JP