发明名称 Internal chamfering device and method
摘要 A method of forming an opening in a layered structure includes providing a layered structure including a first layer and a second layer and a near-zero gap interface defined between the first layer and the second layer; providing an opening through the layered structure such that the opening extends through the first layer and the second layer; and working simultaneously the opening in the fay surface of the first layer and the opening in the fay surface of the second layer without separating the first layer and the second layer. An internal chamfering device is also disclosed.
申请公布号 US9517511(B1) 申请公布日期 2016.12.13
申请号 US201313784442 申请日期 2013.03.04
申请人 THE BOEING COMPANY 发明人 Sisco Farahnaz;Gray Everette D.;Tsegga Mekonnen
分类号 B23B35/00;B23Q17/22;B23B51/10;B23B29/034 主分类号 B23B35/00
代理机构 Hanley, Flight & Zimmerman, LLC 代理人 Hanley, Flight & Zimmerman, LLC
主权项 1. A method of forming an opening in a layered structure, comprising: transmitting and receiving a signal to determine a location of an interface between a first fay surface of a first layer and a second fay surface of a second layer without separating the first and second layers, an aperture extending through at least a portion of the first layer and the second layer; based on the location of the interface, working simultaneously the opening in the first fay surface of the first layer and the opening in the second fay surface of the second layer without separating the first layer and second layer, wherein prior to the transmitting and the receiving of the signal to determine the location of the interface, further comprising: removing a first fastener from the aperture defined by the layered structure, the aperture comprising a first diameter; boring the aperture to comprise a second diameter without separating the first and second layers, the second diameter greater than the first diameter; the transmitting and the receiving of the signal to determine the location of the interface including determining the location of the interface between the first and second layers using an ultrasonic sensor; and the working simultaneously of the opening including working the interface between the first and second layers to remove a burr created when boring the aperture.
地址 Chicago IL US