METHOD OF SOLDERING ELECTRONIC COMPONENT

摘要

PURPOSE:To realizing adequate soldering without solder creeping up leads by decreasing solderability on other portions than those to be connected with a foot print. CONSTITUTION:Solder paste 9 is applied by screen printing to a foot print 7 patterned on a printed-circuit board 2. Leads 10 of a hybrid device 1, except the part 11 to be soldered, are coated with solder resist 13, and epoxy resin is heated to 120 deg.C for curing. Leads are positioned to the foot print on the circuit board, and the circuit board with devices mounted is transferred through an infrared furnace at a speed of 800mm/mim. The furnace includes four heaters 4, which are set at 360 deg.C, 190 deg.C, 190 deg.C and 400 deg.C, respectively, along the path of the circuit board. In this way of soldering, solder is prevented from creeping up the leads, thus realizing adequate soldering.